Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates. - Laksono, Andromeda Dwi; Tsai, Tzu-Yang; Chung, Tai-Hsuan; Chang, Yong-Chi; Yen, Yee-Wen (Metals (2075-4701), 2023)