Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates.
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| Title: | Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates. |
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| Authors: | Laksono, Andromeda Dwi1, Tsai, Tzu-Yang1, Chung, Tai-Hsuan1, Chang, Yong-Chi1, Yen, Yee-Wen1, ywyen@mail.ntust.edu.tw |
| Source: | Metals (2075-4701); Jan2023, Vol. 13 Issue 1, p12, 16p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 20754701 |
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| DOI: | 10.3390/met13010012 |
