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Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method.

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Bibliographic Details
Title:	Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method.
Authors:	Meng, Fanchang¹, Zhang, Zili^1,2, zhangzili@ime.ac.cn, Kang, Yanhui³, Cui, Chengjun¹, Wang, Dezhao², Zhang, Xinxin², Zhou, Weihu^1,2
Source:	Applied Sciences (2076-3417); Feb2023, Vol. 13 Issue 3, p1997, 10p
Database:	Applied Science & Technology Source
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ISSN:	20763417
DOI:	10.3390/app13031997