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Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method.

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Title: Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method.
Authors: Meng, Fanchang1, Zhang, Zili1,2, zhangzili@ime.ac.cn, Kang, Yanhui3, Cui, Chengjun1, Wang, Dezhao2, Zhang, Xinxin2, Zhou, Weihu1,2
Source: Applied Sciences (2076-3417); Feb2023, Vol. 13 Issue 3, p1997, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 161819772
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method.
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  Data: <searchLink fieldCode="AU" term="%22Meng%2C+Fanchang%22">Meng, Fanchang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Zili%22">Zhang, Zili</searchLink><relatesTo>1,2</relatesTo>, <i>zhangzili@ime.ac.cn</i><br /><searchLink fieldCode="AU" term="%22Kang%2C+Yanhui%22">Kang, Yanhui</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Cui%2C+Chengjun%22">Cui, Chengjun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Dezhao%22">Wang, Dezhao</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Xinxin%22">Zhang, Xinxin</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhou%2C+Weihu%22">Zhou, Weihu</searchLink><relatesTo>1,2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Applied+Sciences+%282076-3417%29%22">Applied Sciences (2076-3417)</searchLink>; Feb2023, Vol. 13 Issue 3, p1997, 10p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=161819772
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.3390/app13031997
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      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 10
        StartPage: 1997
    Titles:
      – TitleFull: Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Meng, Fanchang
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          Name:
            NameFull: Zhang, Zili
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            NameFull: Kang, Yanhui
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            NameFull: Cui, Chengjun
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            NameFull: Wang, Dezhao
      – PersonEntity:
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            NameFull: Zhang, Xinxin
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            NameFull: Zhou, Weihu
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            – D: 01
              M: 02
              Text: Feb2023
              Type: published
              Y: 2023
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              Value: 13
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            – TitleFull: Applied Sciences (2076-3417)
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