APA (7th ed.) Citation

Niu, T., Xu, K., Shen, C., Sun, T., Oberst, J., Handwerker, C. A., . . . Zhang, X. (2023). In Situ Study on Cu-to-Cu Thermal Compression Bonding. Crystals (2073-4352), 13(7), 989. https://doi.org/10.3390/cryst13070989

Chicago Style (17th ed.) Citation

Niu, Tongjun, Ke Xu, Chao Shen, Tianyi Sun, Justin Oberst, Carol A. Handwerker, Ganesh Subbarayan, Haiyan Wang, and Xinghang Zhang. "In Situ Study on Cu-to-Cu Thermal Compression Bonding." Crystals (2073-4352) 13, no. 7 (2023): 989. https://doi.org/10.3390/cryst13070989.

MLA (9th ed.) Citation

Niu, Tongjun, et al. "In Situ Study on Cu-to-Cu Thermal Compression Bonding." Crystals (2073-4352), vol. 13, no. 7, 2023, p. 989, https://doi.org/10.3390/cryst13070989.