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In Situ Study on Cu-to-Cu Thermal Compression Bonding.

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Bibliographic Details
Title: In Situ Study on Cu-to-Cu Thermal Compression Bonding.
Authors: Niu, Tongjun1, niutj0804@gmail.com, Xu, Ke2, Shen, Chao2, Sun, Tianyi2, Oberst, Justin3, Handwerker, Carol A.2, Subbarayan, Ganesh4, Wang, Haiyan2,5, Zhang, Xinghang2, xzhang98@purdue.edu
Source: Crystals (2073-4352); Jul2023, Vol. 13 Issue 7, p989, 10p
Database: Applied Science & Technology Source
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ISSN:20734352
DOI:10.3390/cryst13070989