APA (7th ed.) Citation

Satoh, T., Wakasugi, M., & Usui, M. (2024). Influence of Surface Metal and Current Direction on Degradation Behavior of Sintered Silver Joint Under High-Density Current. Journal of Electronic Materials, 53(1), 217. https://doi.org/10.1007/s11664-023-10771-6

Chicago Style (17th ed.) Citation

Satoh, Toshikazu, Makoto Wakasugi, and Masanori Usui. "Influence of Surface Metal and Current Direction on Degradation Behavior of Sintered Silver Joint Under High-Density Current." Journal of Electronic Materials 53, no. 1 (2024): 217. https://doi.org/10.1007/s11664-023-10771-6.

MLA (9th ed.) Citation

Satoh, Toshikazu, et al. "Influence of Surface Metal and Current Direction on Degradation Behavior of Sintered Silver Joint Under High-Density Current." Journal of Electronic Materials, vol. 53, no. 1, 2024, p. 217, https://doi.org/10.1007/s11664-023-10771-6.