APA (7th ed.) Citation

Feng, T., Pati, B., Chung, K. M., Pei, Y., & Chen, R. (2024). Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder. Journal of Materials Science: Materials in Electronics, 35(6), 1. https://doi.org/10.1007/s10854-024-12176-5

Chicago Style (17th ed.) Citation

Feng, Tianshi, Bhabana Pati, Ka Man Chung, Yu Pei, and Renkun Chen. "Ceramic-to-metal Bonding Using Rare-earth Containing Sn–Bi Solder." Journal of Materials Science: Materials in Electronics 35, no. 6 (2024): 1. https://doi.org/10.1007/s10854-024-12176-5.

MLA (9th ed.) Citation

Feng, Tianshi, et al. "Ceramic-to-metal Bonding Using Rare-earth Containing Sn–Bi Solder." Journal of Materials Science: Materials in Electronics, vol. 35, no. 6, 2024, p. 1, https://doi.org/10.1007/s10854-024-12176-5.