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Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder.

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Title: Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder.
Authors: Feng, Tianshi1, Pati, Bhabana2, bpati@psicorp.com, Chung, Ka Man3, Pei, Yu1, Chen, Renkun1,3, rkchen@ucsd.edu
Source: Journal of Materials Science: Materials in Electronics; Feb2024, Vol. 35 Issue 6, p1-12, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 175566252
AccessLevel: 2
PubType: Academic Journal
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  Data: Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder.
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  Data: <searchLink fieldCode="AU" term="%22Feng%2C+Tianshi%22">Feng, Tianshi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Pati%2C+Bhabana%22">Pati, Bhabana</searchLink><relatesTo>2</relatesTo>, <i>bpati@psicorp.com</i><br /><searchLink fieldCode="AU" term="%22Chung%2C+Ka+Man%22">Chung, Ka Man</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Pei%2C+Yu%22">Pei, Yu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Renkun%22">Chen, Renkun</searchLink><relatesTo>1,3</relatesTo>, <i>rkchen@ucsd.edu</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Feb2024, Vol. 35 Issue 6, p1-12, 12p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=175566252
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-12176-5
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      – Code: eng
        Text: English
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        PageCount: 12
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      – TitleFull: Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder.
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            NameFull: Feng, Tianshi
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            NameFull: Pati, Bhabana
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            NameFull: Chung, Ka Man
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            NameFull: Pei, Yu
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            NameFull: Chen, Renkun
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            – D: 21
              M: 02
              Text: Feb2024
              Type: published
              Y: 2024
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              Value: 35
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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