APA (7th ed.) Citation

Min, S., Jo, Y., Ryu, S. Y., Lee, J., Ahn, C., & Kim, C. B. (2024). High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability. Advanced Materials Interfaces, 11(6), 1. https://doi.org/10.1002/admi.202300860

Chicago Style (17th ed.) Citation

Min, Seong‐Bae, Yongsu Jo, Seoung Young Ryu, Joohyung Lee, Cheol‐Woo Ahn, and Chae Bin Kim. "High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability." Advanced Materials Interfaces 11, no. 6 (2024): 1. https://doi.org/10.1002/admi.202300860.

MLA (9th ed.) Citation

Min, Seong‐Bae, et al. "High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability." Advanced Materials Interfaces, vol. 11, no. 6, 2024, p. 1, https://doi.org/10.1002/admi.202300860.