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High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability.

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Title: High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability.
Authors: Min, Seong‐Bae1, Jo, Yongsu1, Ryu, Seoung Young2, Lee, Joohyung2, ljbro@mju.ac.kr, Ahn, Cheol‐Woo3, cheoruahn@kims.re.kr, Kim, Chae Bin1,4, cbkim@pusan.ac.kr
Source: Advanced Materials Interfaces; 2/23/2024, Vol. 11 Issue 6, p1-13, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 175639237
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability.
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        Value: 10.1002/admi.202300860
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      – Code: eng
        Text: English
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      – TitleFull: High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability.
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            NameFull: Jo, Yongsu
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            NameFull: Lee, Joohyung
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            NameFull: Ahn, Cheol‐Woo
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              Text: 2/23/2024
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              Y: 2024
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