High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability. - Min, Seong‐Bae; Jo, Yongsu; Ryu, Seoung Young; Lee, Joohyung; Ahn, Cheol‐Woo; Kim, Chae Bin (Advanced Materials Interfaces, 2024)