APA (7th ed.) Citation

Zhang, S., Long, W., Li, P., Liu, F., Xue, H., & Ding, T. (2024). Low-temperature lead-free SnBiIn solder for electronic packaging. Journal of Materials Science: Materials in Electronics, 35(10), 1. https://doi.org/10.1007/s10854-024-12405-x

Chicago Style (17th ed.) Citation

Zhang, Shannan, Weimin Long, Peiyan Li, Fuli Liu, Hangyan Xue, and Tianran Ding. "Low-temperature Lead-free SnBiIn Solder for Electronic Packaging." Journal of Materials Science: Materials in Electronics 35, no. 10 (2024): 1. https://doi.org/10.1007/s10854-024-12405-x.

MLA (9th ed.) Citation

Zhang, Shannan, et al. "Low-temperature Lead-free SnBiIn Solder for Electronic Packaging." Journal of Materials Science: Materials in Electronics, vol. 35, no. 10, 2024, p. 1, https://doi.org/10.1007/s10854-024-12405-x.