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Low-temperature lead-free SnBiIn solder for electronic packaging.

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Title: Low-temperature lead-free SnBiIn solder for electronic packaging.
Authors: Zhang, Shannan1, Long, Weimin1, Li, Peiyan1, Liu, Fuli1, Xue, Hangyan1, Ding, Tianran1, dtrdtr@163.com
Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 10, p1-9, 9p
Database: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: <searchLink fieldCode="AU" term="%22Zhang%2C+Shannan%22">Zhang, Shannan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Long%2C+Weimin%22">Long, Weimin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Peiyan%22">Li, Peiyan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Fuli%22">Liu, Fuli</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xue%2C+Hangyan%22">Xue, Hangyan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ding%2C+Tianran%22">Ding, Tianran</searchLink><relatesTo>1</relatesTo>, <i>dtrdtr@163.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2024, Vol. 35 Issue 10, p1-9, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=176423805
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        Value: 10.1007/s10854-024-12405-x
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        Text: English
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      – TitleFull: Low-temperature lead-free SnBiIn solder for electronic packaging.
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            NameFull: Long, Weimin
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            NameFull: Li, Peiyan
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            NameFull: Liu, Fuli
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            NameFull: Xue, Hangyan
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            – D: 01
              M: 04
              Text: Apr2024
              Type: published
              Y: 2024
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