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Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints.

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Bibliographic Details
Title: Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints.
Authors: Gong, Shiliang1, Chen, Gaoqiang1, Qu, Songtao1, Duk, Vichea1, Xu, Xun1, Shi, Qingyu1, Zhang, Gong1, zhangg@tsinghua.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 11, p1-15, 15p
Database: Applied Science & Technology Source
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Description
ISSN:09574522
DOI:10.1007/s10854-024-12440-8