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Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints.

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Title: Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints.
Authors: Gong, Shiliang1, Chen, Gaoqiang1, Qu, Songtao1, Duk, Vichea1, Xu, Xun1, Shi, Qingyu1, Zhang, Gong1, zhangg@tsinghua.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 11, p1-15, 15p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 176584599
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints.
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  Data: <searchLink fieldCode="AU" term="%22Gong%2C+Shiliang%22">Gong, Shiliang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Gaoqiang%22">Chen, Gaoqiang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Qu%2C+Songtao%22">Qu, Songtao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Duk%2C+Vichea%22">Duk, Vichea</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xu%2C+Xun%22">Xu, Xun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Shi%2C+Qingyu%22">Shi, Qingyu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Gong%22">Zhang, Gong</searchLink><relatesTo>1</relatesTo>, <i>zhangg@tsinghua.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2024, Vol. 35 Issue 11, p1-15, 15p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=176584599
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-024-12440-8
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      – Code: eng
        Text: English
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        PageCount: 15
        StartPage: 1
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      – TitleFull: Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints.
        Type: main
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          Name:
            NameFull: Gong, Shiliang
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            NameFull: Chen, Gaoqiang
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            NameFull: Qu, Songtao
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            NameFull: Duk, Vichea
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            NameFull: Xu, Xun
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            NameFull: Shi, Qingyu
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            NameFull: Zhang, Gong
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          Dates:
            – D: 11
              M: 04
              Text: Apr2024
              Type: published
              Y: 2024
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              Value: 35
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              Value: 11
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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