Laksono, A. D., Shen, Y., Chen, T., & Yen, Y. (2024). Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 76(6), 2754. https://doi.org/10.1007/s11837-024-06426-4
Chicago Style (17th ed.) CitationLaksono, Andromeda Dwi, Yu-An Shen, Ting Chen, and Yee-Wen Yen. "Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder." JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 76, no. 6 (2024): 2754. https://doi.org/10.1007/s11837-024-06426-4.
MLA (9th ed.) CitationLaksono, Andromeda Dwi, et al. "Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder." JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 76, no. 6, 2024, p. 2754, https://doi.org/10.1007/s11837-024-06426-4.