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Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder.

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Title: Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder.
Authors: Laksono, Andromeda Dwi1, Shen, Yu-An2, Chen, Ting1, Yen, Yee-Wen1,3, ywyen@mail.ntust.edu.tw
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2024, Vol. 76 Issue 6, p2754-2762, 9p
Database: Applied Science & Technology Source
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  Data: Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder.
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      – Type: doi
        Value: 10.1007/s11837-024-06426-4
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      – Code: eng
        Text: English
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        PageCount: 9
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      – TitleFull: Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder.
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            NameFull: Laksono, Andromeda Dwi
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            NameFull: Shen, Yu-An
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            NameFull: Chen, Ting
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            – D: 01
              M: 06
              Text: Jun2024
              Type: published
              Y: 2024
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