Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder.
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| Title: | Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder. |
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| Authors: | Laksono, Andromeda Dwi1, Shen, Yu-An2, Chen, Ting1, Yen, Yee-Wen1,3, ywyen@mail.ntust.edu.tw |
| Source: | JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2024, Vol. 76 Issue 6, p2754-2762, 9p |
| Database: | Applied Science & Technology Source |
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