Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method.
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| Title: | Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method. |
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| Authors: | Wu, Zijian1,2,3, Gao, Shunying1, Wang, Xuefei1, Ibrahim, Mohamed M.4, Mersal, Gaber A. M.4, Ren, Juanna5, El-Bahy, Zeinhom M.6, Guo, Ning1,2, tad@hrbust.edu.cn, Gao, Junguo1,2, gaojunguo@hrbust.edu.cn, Weng, Ling1,2, l.weng@hrbust.edu.cn, Guo, Zhanhu3, zhanhu.guo@northumbria.ac.uk |
| Source: | Journal of Materials Science: Materials in Electronics; May2024, Vol. 35 Issue 15, p1-13, 13p |
| Database: | Applied Science & Technology Source |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 177641237 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Wu%2C+Zijian%22">Wu, Zijian</searchLink><relatesTo>1,2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Gao%2C+Shunying%22">Gao, Shunying</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Xuefei%22">Wang, Xuefei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ibrahim%2C+Mohamed+M%2E%22">Ibrahim, Mohamed M.</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Mersal%2C+Gaber+A%2E+M%2E%22">Mersal, Gaber A. M.</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Ren%2C+Juanna%22">Ren, Juanna</searchLink><relatesTo>5</relatesTo><br /><searchLink fieldCode="AU" term="%22El-Bahy%2C+Zeinhom+M%2E%22">El-Bahy, Zeinhom M.</searchLink><relatesTo>6</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Ning%22">Guo, Ning</searchLink><relatesTo>1,2</relatesTo>, <i>tad@hrbust.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Gao%2C+Junguo%22">Gao, Junguo</searchLink><relatesTo>1,2</relatesTo>, <i>gaojunguo@hrbust.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Weng%2C+Ling%22">Weng, Ling</searchLink><relatesTo>1,2</relatesTo>, <i>l.weng@hrbust.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Guo%2C+Zhanhu%22">Guo, Zhanhu</searchLink><relatesTo>3</relatesTo>, <i>zhanhu.guo@northumbria.ac.uk</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; May2024, Vol. 35 Issue 15, p1-13, 13p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=177641237 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-024-12794-z Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 13 StartPage: 1 Titles: – TitleFull: Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Wu, Zijian – PersonEntity: Name: NameFull: Gao, Shunying – PersonEntity: Name: NameFull: Wang, Xuefei – PersonEntity: Name: NameFull: Ibrahim, Mohamed M. – PersonEntity: Name: NameFull: Mersal, Gaber A. M. – PersonEntity: Name: NameFull: Ren, Juanna – PersonEntity: Name: NameFull: El-Bahy, Zeinhom M. – PersonEntity: Name: NameFull: Guo, Ning – PersonEntity: Name: NameFull: Gao, Junguo – PersonEntity: Name: NameFull: Weng, Ling – PersonEntity: Name: NameFull: Guo, Zhanhu IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 05 Text: May2024 Type: published Y: 2024 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 35 – Type: issue Value: 15 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
| ResultId | 1 |