A PVA-based electronic-packaging ceramic composite with water-degradable characteristics prepared by low-temperature fast firing.

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Title: A PVA-based electronic-packaging ceramic composite with water-degradable characteristics prepared by low-temperature fast firing.
Authors: Lin, Yu-xia1, Zhan, Long1, Wang, Cheng-lin1, Zhuang, Peng-hui1, Xiao, Rui-hao1, Chen, Song1, schen2012@swjtu.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Jun2024, Vol. 35 Issue 17, p1-15, 15p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 177890622
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  Data: A PVA-based electronic-packaging ceramic composite with water-degradable characteristics prepared by low-temperature fast firing.
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  Data: <searchLink fieldCode="AU" term="%22Lin%2C+Yu-xia%22">Lin, Yu-xia</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhan%2C+Long%22">Zhan, Long</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Cheng-lin%22">Wang, Cheng-lin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhuang%2C+Peng-hui%22">Zhuang, Peng-hui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xiao%2C+Rui-hao%22">Xiao, Rui-hao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Song%22">Chen, Song</searchLink><relatesTo>1</relatesTo>, <i>schen2012@swjtu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2024, Vol. 35 Issue 17, p1-15, 15p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=177890622
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-12893-x
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      – Code: eng
        Text: English
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        PageCount: 15
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      – TitleFull: A PVA-based electronic-packaging ceramic composite with water-degradable characteristics prepared by low-temperature fast firing.
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            NameFull: Lin, Yu-xia
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            NameFull: Zhan, Long
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            NameFull: Wang, Cheng-lin
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            NameFull: Zhuang, Peng-hui
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            NameFull: Xiao, Rui-hao
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            NameFull: Chen, Song
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            – D: 11
              M: 06
              Text: Jun2024
              Type: published
              Y: 2024
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              Value: 35
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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