APA (7th ed.) Citation

Shih, M., Liu, Y., Lin, G., Hsu, E., & Yang, J. (2024). Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages. Experimental Techniques, 48(4), 599. https://doi.org/10.1007/s40799-023-00679-5

Chicago Style (17th ed.) Citation

Shih, M.-K, Y.-H Liu, G.-S Lin, E. Hsu, and J. Yang. "Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages." Experimental Techniques 48, no. 4 (2024): 599. https://doi.org/10.1007/s40799-023-00679-5.

MLA (9th ed.) Citation

Shih, M.-K, et al. "Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages." Experimental Techniques, vol. 48, no. 4, 2024, p. 599, https://doi.org/10.1007/s40799-023-00679-5.