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Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages.

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Bibliographic Details
Title: Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages.
Authors: Shih, M.-K.1, mkshih@nfu.edu.tw, Liu, Y.-H.1, Lin, G.-S.1, Hsu, E.2, Yang, J.2
Source: Experimental Techniques; Aug2024, Vol. 48 Issue 4, p599-609, 11p
Database: Applied Science & Technology Source
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ISSN:07328818
DOI:10.1007/s40799-023-00679-5