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Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages.

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Title: Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages.
Authors: Shih, M.-K.1, mkshih@nfu.edu.tw, Liu, Y.-H.1, Lin, G.-S.1, Hsu, E.2, Yang, J.2
Source: Experimental Techniques; Aug2024, Vol. 48 Issue 4, p599-609, 11p
Database: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages.
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        Value: 10.1007/s40799-023-00679-5
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      – Code: eng
        Text: English
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      – TitleFull: Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages.
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              M: 08
              Text: Aug2024
              Type: published
              Y: 2024
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              Value: 48
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