Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation.
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| Title: | Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation. |
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| Authors: | Ridzwan, M. N. A. M.1, Abdullah, M. F.2, faizol@ieee.org, Yussof, A. M. M.1, Aziz, N. A.1, Lee, H. W.2 |
| Source: | Journal of Electronic Materials; Sep2024, Vol. 53 Issue 9, p5519-5533, 15p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-024-11281-9 |
