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Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation.

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Title: Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation.
Authors: Ridzwan, M. N. A. M.1, Abdullah, M. F.2, faizol@ieee.org, Yussof, A. M. M.1, Aziz, N. A.1, Lee, H. W.2
Source: Journal of Electronic Materials; Sep2024, Vol. 53 Issue 9, p5519-5533, 15p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
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PubType: Academic Journal
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        Value: 10.1007/s11664-024-11281-9
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        Text: English
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      – TitleFull: Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation.
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              Text: Sep2024
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