APA (7th ed.) Citation

Jasmee, S., Palagud Jr, J., SW, W., Hoo, K. I., Masdzarif, N. D. I., Lim, T. S., & Omar, G. (2024). Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA. Journal of Materials Science: Materials in Electronics, 35(22), 1. https://doi.org/10.1007/s10854-024-13221-z

Chicago Style (17th ed.) Citation

Jasmee, S., Jose Palagud Jr, Wang SW, K. I. Hoo, N. D. I. Masdzarif, T. S. Lim, and G. Omar. "Free Air Ball and Bondability Behaviours of Au-coated Ag Alloy Wire at Various Electro Flame-off and Bonding Parameters for CMOS IBGA." Journal of Materials Science: Materials in Electronics 35, no. 22 (2024): 1. https://doi.org/10.1007/s10854-024-13221-z.

MLA (9th ed.) Citation

Jasmee, S., et al. "Free Air Ball and Bondability Behaviours of Au-coated Ag Alloy Wire at Various Electro Flame-off and Bonding Parameters for CMOS IBGA." Journal of Materials Science: Materials in Electronics, vol. 35, no. 22, 2024, p. 1, https://doi.org/10.1007/s10854-024-13221-z.