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Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA.

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Title: Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA.
Authors: Jasmee, S.1,2, solehahjasmee@gmail.com, Palagud Jr, Jose1, SW, Wang1, Hoo, K. I.1, Masdzarif, N. D. I.1,2, Lim, T. S.1, Omar, G.2
Source: Journal of Materials Science: Materials in Electronics; Aug2024, Vol. 35 Issue 22, p1-23, 23p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 179012662
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Aug2024, Vol. 35 Issue 22, p1-23, 23p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-13221-z
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      – Code: eng
        Text: English
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        PageCount: 23
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      – TitleFull: Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA.
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            NameFull: Palagud Jr, Jose
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            NameFull: Masdzarif, N. D. I.
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            NameFull: Lim, T. S.
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            – D: 01
              M: 08
              Text: Aug2024
              Type: published
              Y: 2024
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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