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Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.

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Title: Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.
Authors: Lin, Bo-Yi1, Lin, Ting-Chun2, Kao, Chin-Li2, Hsiao, Shih-Chieh1, Tseng, Pei-Hsuan1, Kuo, Jui-Chao1, jckuo@mail.ncku.edu.tw
Source: Journal of Electronic Materials; Oct2024, Vol. 53 Issue 10, p6471-6481, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 179439553
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.
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  Data: <searchLink fieldCode="AU" term="%22Lin%2C+Bo-Yi%22">Lin, Bo-Yi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Ting-Chun%22">Lin, Ting-Chun</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Kao%2C+Chin-Li%22">Kao, Chin-Li</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Hsiao%2C+Shih-Chieh%22">Hsiao, Shih-Chieh</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Tseng%2C+Pei-Hsuan%22">Tseng, Pei-Hsuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Kuo%2C+Jui-Chao%22">Kuo, Jui-Chao</searchLink><relatesTo>1</relatesTo>, <i>jckuo@mail.ncku.edu.tw</i>
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s11664-024-11360-x
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 6471
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      – TitleFull: Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.
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            NameFull: Lin, Bo-Yi
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            NameFull: Lin, Ting-Chun
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            NameFull: Kao, Chin-Li
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            NameFull: Hsiao, Shih-Chieh
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            NameFull: Tseng, Pei-Hsuan
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            NameFull: Kuo, Jui-Chao
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            – D: 01
              M: 10
              Text: Oct2024
              Type: published
              Y: 2024
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              Value: 53
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