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High-Performance FeSiAl Soft Magnetic Composites with Polyethyleneimine/Silicone Resin Double Organic Insulation Layers for 50 kHz–1 MHz Frequency Power Applications.

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Title: High-Performance FeSiAl Soft Magnetic Composites with Polyethyleneimine/Silicone Resin Double Organic Insulation Layers for 50 kHz–1 MHz Frequency Power Applications.
Authors: Li, Xinhui1, Yao, Hanyu1, Wan, Yuanhong1, Sun, Yuping1, Liu, Xianguo1, liuxg@hdu.edu.cn
Source: Journal of Electronic Materials; Nov2024, Vol. 53 Issue 11, p6901-6913, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 180037483
AccessLevel: 2
PubType: Academic Journal
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  Data: High-Performance FeSiAl Soft Magnetic Composites with Polyethyleneimine/Silicone Resin Double Organic Insulation Layers for 50 kHz–1 MHz Frequency Power Applications.
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  Data: <searchLink fieldCode="AU" term="%22Li%2C+Xinhui%22">Li, Xinhui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yao%2C+Hanyu%22">Yao, Hanyu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wan%2C+Yuanhong%22">Wan, Yuanhong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Sun%2C+Yuping%22">Sun, Yuping</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Xianguo%22">Liu, Xianguo</searchLink><relatesTo>1</relatesTo>, <i>liuxg@hdu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Nov2024, Vol. 53 Issue 11, p6901-6913, 13p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=180037483
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s11664-024-11339-8
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      – Code: eng
        Text: English
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        PageCount: 13
        StartPage: 6901
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      – TitleFull: High-Performance FeSiAl Soft Magnetic Composites with Polyethyleneimine/Silicone Resin Double Organic Insulation Layers for 50 kHz–1 MHz Frequency Power Applications.
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            NameFull: Li, Xinhui
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            NameFull: Yao, Hanyu
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            NameFull: Wan, Yuanhong
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            NameFull: Sun, Yuping
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            NameFull: Liu, Xianguo
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            – D: 01
              M: 11
              Text: Nov2024
              Type: published
              Y: 2024
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              Value: 53
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