APA (7th ed.) Citation

Gan, C. L., Chung, M., Huang, C., & Jao, L. (2024). Hydrogen as power storage technology, polymeric and interconnect material innovations for future AI datacenter applications: A review. Journal of Materials Science: Materials in Electronics, 35(30), 1. https://doi.org/10.1007/s10854-024-13705-y

Chicago Style (17th ed.) Citation

Gan, Chong Leong, Min-Hua Chung, Chen-Yu Huang, and Li Jao. "Hydrogen as Power Storage Technology, polymeric and Interconnect Material Innovations for Future AI Datacenter Applications: A Review." Journal of Materials Science: Materials in Electronics 35, no. 30 (2024): 1. https://doi.org/10.1007/s10854-024-13705-y.

MLA (9th ed.) Citation

Gan, Chong Leong, et al. "Hydrogen as Power Storage Technology, polymeric and Interconnect Material Innovations for Future AI Datacenter Applications: A Review." Journal of Materials Science: Materials in Electronics, vol. 35, no. 30, 2024, p. 1, https://doi.org/10.1007/s10854-024-13705-y.