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Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints.

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Title: Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints.
Authors: Li, Fusheng1, Xu, Lei1, Chen, Mingze1, Zhang, Fuwen1, Wang, Zhigang1, Liu, Xixue1, liuxixue@composolder.com, He, Huijun2, hehuijun@gripm.com
Source: Journal of Materials Science: Materials in Electronics; Dec2024, Vol. 35 Issue 34, p1-12, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 181536091
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints.
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  Data: <searchLink fieldCode="AU" term="%22Li%2C+Fusheng%22">Li, Fusheng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xu%2C+Lei%22">Xu, Lei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Mingze%22">Chen, Mingze</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Fuwen%22">Zhang, Fuwen</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Zhigang%22">Wang, Zhigang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Xixue%22">Liu, Xixue</searchLink><relatesTo>1</relatesTo>, <i>liuxixue@composolder.com</i><br /><searchLink fieldCode="AU" term="%22He%2C+Huijun%22">He, Huijun</searchLink><relatesTo>2</relatesTo>, <i>hehuijun@gripm.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Dec2024, Vol. 35 Issue 34, p1-12, 12p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-13936-z
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      – Code: eng
        Text: English
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        PageCount: 12
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      – TitleFull: Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints.
        Type: main
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          Name:
            NameFull: Li, Fusheng
      – PersonEntity:
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            NameFull: Xu, Lei
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            NameFull: Chen, Mingze
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            NameFull: Zhang, Fuwen
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            NameFull: Wang, Zhigang
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            NameFull: Liu, Xixue
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            NameFull: He, Huijun
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          Dates:
            – D: 01
              M: 12
              Text: Dec2024
              Type: published
              Y: 2024
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              Value: 35
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              Value: 34
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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