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Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating.

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Bibliographic Details
Title: Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating.
Authors: Yu, Zhong-Yen1, Wu, Chen-Yu1, Fu, Kuan-Lin1, Chang, Jui-Sheng1, Yen, Tzu-Hsuan1, Tsai, Chieh-Pu1, Hsu, Ya-Hui1, Lee, Yun-Fong1, Liu, Cheng-Yi1, chengyiliuoem@gmail.com
Source: Journal of Materials Science: Materials in Electronics; Jan2025, Vol. 36 Issue 1, p1-11, 11p
Database: Applied Science & Technology Source
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ISSN:09574522
DOI:10.1007/s10854-024-14149-0