View in EDS HTML Full Text PDF Full Text

Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating.

Saved in:
Bibliographic Details
Title: Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating.
Authors: Yu, Zhong-Yen1, Wu, Chen-Yu1, Fu, Kuan-Lin1, Chang, Jui-Sheng1, Yen, Tzu-Hsuan1, Tsai, Chieh-Pu1, Hsu, Ya-Hui1, Lee, Yun-Fong1, Liu, Cheng-Yi1, chengyiliuoem@gmail.com
Source: Journal of Materials Science: Materials in Electronics; Jan2025, Vol. 36 Issue 1, p1-11, 11p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 182089383
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Yu%2C+Zhong-Yen%22">Yu, Zhong-Yen</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wu%2C+Chen-Yu%22">Wu, Chen-Yu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Fu%2C+Kuan-Lin%22">Fu, Kuan-Lin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chang%2C+Jui-Sheng%22">Chang, Jui-Sheng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yen%2C+Tzu-Hsuan%22">Yen, Tzu-Hsuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Tsai%2C+Chieh-Pu%22">Tsai, Chieh-Pu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Hsu%2C+Ya-Hui%22">Hsu, Ya-Hui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lee%2C+Yun-Fong%22">Lee, Yun-Fong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Cheng-Yi%22">Liu, Cheng-Yi</searchLink><relatesTo>1</relatesTo>, <i>chengyiliuoem@gmail.com</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jan2025, Vol. 36 Issue 1, p1-11, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=182089383
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-024-14149-0
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 11
        StartPage: 1
    Titles:
      – TitleFull: Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Yu, Zhong-Yen
      – PersonEntity:
          Name:
            NameFull: Wu, Chen-Yu
      – PersonEntity:
          Name:
            NameFull: Fu, Kuan-Lin
      – PersonEntity:
          Name:
            NameFull: Chang, Jui-Sheng
      – PersonEntity:
          Name:
            NameFull: Yen, Tzu-Hsuan
      – PersonEntity:
          Name:
            NameFull: Tsai, Chieh-Pu
      – PersonEntity:
          Name:
            NameFull: Hsu, Ya-Hui
      – PersonEntity:
          Name:
            NameFull: Lee, Yun-Fong
      – PersonEntity:
          Name:
            NameFull: Liu, Cheng-Yi
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 01
              Text: Jan2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 36
            – Type: issue
              Value: 1
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1