APA (7th ed.) Citation

Zhao, J., Ji, X., He, J., Hou, Z., Song, Y., Zhu, H., . . . Wang, Y. (2025). Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints. Journal of Materials Science, 60(2), 922. https://doi.org/10.1007/s10853-024-10549-z

Chicago Style (17th ed.) Citation

Zhao, Jin, Xiao-liang Ji, Jin-jiang He, Zhi-chao Hou, Yao Song, Hong-lei Zhu, Bing-rui Liu, Qiang Jia, and Yi-shu Wang. "Effect of Electric Pulse Auxiliary Reflow Soldering on the Microstructure and Properties of Sn58Bi/Cu Solder Joints." Journal of Materials Science 60, no. 2 (2025): 922. https://doi.org/10.1007/s10853-024-10549-z.

MLA (9th ed.) Citation

Zhao, Jin, et al. "Effect of Electric Pulse Auxiliary Reflow Soldering on the Microstructure and Properties of Sn58Bi/Cu Solder Joints." Journal of Materials Science, vol. 60, no. 2, 2025, p. 922, https://doi.org/10.1007/s10853-024-10549-z.