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Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints.

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Title: Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints.
Authors: Zhao, Jin1,2,3, Ji, Xiao-liang1, He, Jin-jiang2,3, hejinjiang@grikin.com, Hou, Zhi-chao2,3, Song, Yao2,3, Zhu, Hong-lei2,3, Liu, Bing-rui2,3, Jia, Qiang1, Wang, Yi-shu1, yishu.wang@bjut.edu.cn
Source: Journal of Materials Science; Jan2025, Vol. 60 Issue 2, p922-938, 17p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 182152101
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints.
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  Data: <searchLink fieldCode="AU" term="%22Zhao%2C+Jin%22">Zhao, Jin</searchLink><relatesTo>1,2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Ji%2C+Xiao-liang%22">Ji, Xiao-liang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22He%2C+Jin-jiang%22">He, Jin-jiang</searchLink><relatesTo>2,3</relatesTo>, <i>hejinjiang@grikin.com</i><br /><searchLink fieldCode="AU" term="%22Hou%2C+Zhi-chao%22">Hou, Zhi-chao</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Song%2C+Yao%22">Song, Yao</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhu%2C+Hong-lei%22">Zhu, Hong-lei</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Bing-rui%22">Liu, Bing-rui</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Jia%2C+Qiang%22">Jia, Qiang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Yi-shu%22">Wang, Yi-shu</searchLink><relatesTo>1</relatesTo>, <i>yishu.wang@bjut.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%22">Journal of Materials Science</searchLink>; Jan2025, Vol. 60 Issue 2, p922-938, 17p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=182152101
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      – Type: doi
        Value: 10.1007/s10853-024-10549-z
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      – Code: eng
        Text: English
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        PageCount: 17
        StartPage: 922
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      – TitleFull: Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints.
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            NameFull: Ji, Xiao-liang
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              Text: Jan2025
              Type: published
              Y: 2025
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