Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints. - Zhao, Jin; Ji, Xiao-liang; He, Jin-jiang; Hou, Zhi-chao; Song, Yao; Zhu, Hong-lei; Liu, Bing-rui; Jia, Qiang; Wang, Yi-shu (Journal of Materials Science, 2025)