Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints.
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| Title: | Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints. |
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| Authors: | Zhao, Jin1,2,3, Ji, Xiao-liang1, He, Jin-jiang2,3, hejinjiang@grikin.com, Hou, Zhi-chao2,3, Song, Yao2,3, Zhu, Hong-lei2,3, Liu, Bing-rui2,3, Jia, Qiang1, Wang, Yi-shu1, yishu.wang@bjut.edu.cn |
| Source: | Journal of Materials Science; Jan2025, Vol. 60 Issue 2, p922-938, 17p |
| Database: | Applied Science & Technology Source |
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