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Thermal management enhancement of electronic chips based on novel technologies.

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Bibliographic Details
Title: Thermal management enhancement of electronic chips based on novel technologies.
Authors: Chen, Haopeng1,2, Zhang, Tianshi1,2, zhangtianshi@jlu.edu.cn, Gao, Qing1,2, Lv, Jianwei3, Chen, Haibo1,2, chenhb@jlu.edu.cn, Huang, Haizhen1,2
Source: Energy; Feb2025, Vol. 316, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 182502421
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Thermal management enhancement of electronic chips based on novel technologies.
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  Data: <searchLink fieldCode="AU" term="%22Chen%2C+Haopeng%22">Chen, Haopeng</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Tianshi%22">Zhang, Tianshi</searchLink><relatesTo>1,2</relatesTo>, <i>zhangtianshi@jlu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Gao%2C+Qing%22">Gao, Qing</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Lv%2C+Jianwei%22">Lv, Jianwei</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Haibo%22">Chen, Haibo</searchLink><relatesTo>1,2</relatesTo>, <i>chenhb@jlu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Huang%2C+Haizhen%22">Huang, Haizhen</searchLink><relatesTo>1,2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Energy%22">Energy</searchLink>; Feb2025, Vol. 316, pN.PAG-N.PAG, 1p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=182502421
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.energy.2025.134575
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      – Code: eng
        Text: English
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      – TitleFull: Thermal management enhancement of electronic chips based on novel technologies.
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            NameFull: Chen, Haopeng
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            NameFull: Zhang, Tianshi
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            NameFull: Gao, Qing
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            NameFull: Chen, Haibo
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              Text: Feb2025
              Type: published
              Y: 2025
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