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Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.

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Bibliographic Details
Title:	Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.
Authors:	Lee, Dong-Bok¹, Seo, Young-Jin¹, Yoon, Jeong-Won¹, jwyoon@chungbuk.ac.kr
Source:	Journal of Electronic Materials; Mar2025, Vol. 54 Issue 3, p1592-1601, 10p
Database:	Applied Science & Technology Source
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Description
ISSN:	03615235
DOI:	10.1007/s11664-025-11738-5