Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.
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| Title: | Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging. |
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| Authors: | Lee, Dong-Bok1, Seo, Young-Jin1, Yoon, Jeong-Won1, jwyoon@chungbuk.ac.kr |
| Source: | Journal of Electronic Materials; Mar2025, Vol. 54 Issue 3, p1592-1601, 10p |
| Database: | Applied Science & Technology Source |
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