APA (7th ed.) Citation

Hou, B., Zhou, M. B., & Zhang, X. P. (2025). A comprehensive and in-depth study of pressureless and low-temperature in-air sintering performance of bimodal-sized Cu nanoparticle pastes for die attachment and the joint strengthening mechanism. Journal of Materials Science: Materials in Electronics, 36(5), 1. https://doi.org/10.1007/s10854-025-14323-y

Chicago Style (17th ed.) Citation

Hou, B., M. B. Zhou, and X. P. Zhang. "A Comprehensive and In-depth Study of Pressureless and Low-temperature In-air Sintering Performance of Bimodal-sized Cu Nanoparticle Pastes for Die Attachment and the Joint Strengthening Mechanism." Journal of Materials Science: Materials in Electronics 36, no. 5 (2025): 1. https://doi.org/10.1007/s10854-025-14323-y.

MLA (9th ed.) Citation

Hou, B., et al. "A Comprehensive and In-depth Study of Pressureless and Low-temperature In-air Sintering Performance of Bimodal-sized Cu Nanoparticle Pastes for Die Attachment and the Joint Strengthening Mechanism." Journal of Materials Science: Materials in Electronics, vol. 36, no. 5, 2025, p. 1, https://doi.org/10.1007/s10854-025-14323-y.