A comprehensive and in-depth study of pressureless and low-temperature in-air sintering performance of bimodal-sized Cu nanoparticle pastes for die attachment and the joint strengthening mechanism.
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| Title: | A comprehensive and in-depth study of pressureless and low-temperature in-air sintering performance of bimodal-sized Cu nanoparticle pastes for die attachment and the joint strengthening mechanism. |
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| Authors: | Hou, B.1,2, Zhou, M. B.1,2, Zhang, X. P.1,2, mexzhang@scut.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Feb2025, Vol. 36 Issue 5, p1-21, 21p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-025-14323-y |
