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A comprehensive and in-depth study of pressureless and low-temperature in-air sintering performance of bimodal-sized Cu nanoparticle pastes for die attachment and the joint strengthening mechanism.

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Title: A comprehensive and in-depth study of pressureless and low-temperature in-air sintering performance of bimodal-sized Cu nanoparticle pastes for die attachment and the joint strengthening mechanism.
Authors: Hou, B.1,2, Zhou, M. B.1,2, Zhang, X. P.1,2, mexzhang@scut.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Feb2025, Vol. 36 Issue 5, p1-21, 21p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 182958514
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: A comprehensive and in-depth study of pressureless and low-temperature in-air sintering performance of bimodal-sized Cu nanoparticle pastes for die attachment and the joint strengthening mechanism.
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  Data: <searchLink fieldCode="AU" term="%22Hou%2C+B%2E%22">Hou, B.</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhou%2C+M%2E+B%2E%22">Zhou, M. B.</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+X%2E+P%2E%22">Zhang, X. P.</searchLink><relatesTo>1,2</relatesTo>, <i>mexzhang@scut.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Feb2025, Vol. 36 Issue 5, p1-21, 21p
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        Value: 10.1007/s10854-025-14323-y
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      – Code: eng
        Text: English
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        PageCount: 21
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      – TitleFull: A comprehensive and in-depth study of pressureless and low-temperature in-air sintering performance of bimodal-sized Cu nanoparticle pastes for die attachment and the joint strengthening mechanism.
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            NameFull: Hou, B.
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            NameFull: Zhou, M. B.
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              Text: Feb2025
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