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Strength enhancement of laser 3D‐printed SiC green bodies by epoxy resin and phenolic resin dual binders.

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Title: Strength enhancement of laser 3D‐printed SiC green bodies by epoxy resin and phenolic resin dual binders.
Authors: Wang, Li1,2, Yin, Jie1,3, jieyin@mail.sic.ac.cn, Tian, Huisheng1,3, Chen, Xiao1,3, Wang, Kanglong1, Huang, Zhengren1, zhrhuang@mail.sic.ac.cn
Source: Journal of the American Ceramic Society; Jun2025, Vol. 108 Issue 6, p1-13, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 184273655
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Strength enhancement of laser 3D‐printed SiC green bodies by epoxy resin and phenolic resin dual binders.
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  Data: <searchLink fieldCode="AU" term="%22Wang%2C+Li%22">Wang, Li</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yin%2C+Jie%22">Yin, Jie</searchLink><relatesTo>1,3</relatesTo>, <i>jieyin@mail.sic.ac.cn</i><br /><searchLink fieldCode="AU" term="%22Tian%2C+Huisheng%22">Tian, Huisheng</searchLink><relatesTo>1,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Xiao%22">Chen, Xiao</searchLink><relatesTo>1,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Kanglong%22">Wang, Kanglong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Zhengren%22">Huang, Zhengren</searchLink><relatesTo>1</relatesTo>, <i>zhrhuang@mail.sic.ac.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+the+American+Ceramic+Society%22">Journal of the American Ceramic Society</searchLink>; Jun2025, Vol. 108 Issue 6, p1-13, 13p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=184273655
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1111/jace.20455
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 13
        StartPage: 1
    Titles:
      – TitleFull: Strength enhancement of laser 3D‐printed SiC green bodies by epoxy resin and phenolic resin dual binders.
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            NameFull: Wang, Li
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            NameFull: Yin, Jie
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            NameFull: Tian, Huisheng
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            NameFull: Chen, Xiao
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            NameFull: Wang, Kanglong
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            NameFull: Huang, Zhengren
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          Dates:
            – D: 01
              M: 06
              Text: Jun2025
              Type: published
              Y: 2025
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              Value: 108
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            – TitleFull: Journal of the American Ceramic Society
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