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Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging.

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Bibliographic Details
Title:	Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging.
Authors:	Chen, Yuanhang^1,2, Sui, Yuying², Li, Peng², Zhang, Feng², Yu, Shuhui^2,3, Luo, Suibin^2,3, sb.luo@siat.ac.cn
Source:	Advanced Engineering Materials; Apr2025, Vol. 27 Issue 7, p1-9, 9p
Database:	Applied Science & Technology Source

Description
ISSN:	14381656
DOI:	10.1002/adem.202402636