Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging.

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Title: Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging.
Authors: Chen, Yuanhang1,2, Sui, Yuying2, Li, Peng2, Zhang, Feng2, Yu, Shuhui2,3, Luo, Suibin2,3, sb.luo@siat.ac.cn
Source: Advanced Engineering Materials; Apr2025, Vol. 27 Issue 7, p1-9, 9p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 184320666
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging.
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  Data: <searchLink fieldCode="AU" term="%22Chen%2C+Yuanhang%22">Chen, Yuanhang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Sui%2C+Yuying%22">Sui, Yuying</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Peng%22">Li, Peng</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Feng%22">Zhang, Feng</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yu%2C+Shuhui%22">Yu, Shuhui</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Luo%2C+Suibin%22">Luo, Suibin</searchLink><relatesTo>2,3</relatesTo>, <i>sb.luo@siat.ac.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Advanced+Engineering+Materials%22">Advanced Engineering Materials</searchLink>; Apr2025, Vol. 27 Issue 7, p1-9, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=184320666
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1002/adem.202402636
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      – Code: eng
        Text: English
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        PageCount: 9
        StartPage: 1
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      – TitleFull: Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging.
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            NameFull: Chen, Yuanhang
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            NameFull: Sui, Yuying
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            NameFull: Li, Peng
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            NameFull: Zhang, Feng
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            NameFull: Yu, Shuhui
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            NameFull: Luo, Suibin
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            – D: 01
              M: 04
              Text: Apr2025
              Type: published
              Y: 2025
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              Value: 27
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