Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging.
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| Title: | Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging. |
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| Authors: | Chen, Yuanhang1,2, Sui, Yuying2, Li, Peng2, Zhang, Feng2, Yu, Shuhui2,3, Luo, Suibin2,3, sb.luo@siat.ac.cn |
| Source: | Advanced Engineering Materials; Apr2025, Vol. 27 Issue 7, p1-9, 9p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 184320666 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Chen%2C+Yuanhang%22">Chen, Yuanhang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Sui%2C+Yuying%22">Sui, Yuying</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Peng%22">Li, Peng</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Feng%22">Zhang, Feng</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yu%2C+Shuhui%22">Yu, Shuhui</searchLink><relatesTo>2,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Luo%2C+Suibin%22">Luo, Suibin</searchLink><relatesTo>2,3</relatesTo>, <i>sb.luo@siat.ac.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Advanced+Engineering+Materials%22">Advanced Engineering Materials</searchLink>; Apr2025, Vol. 27 Issue 7, p1-9, 9p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=184320666 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1002/adem.202402636 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 9 StartPage: 1 Titles: – TitleFull: Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Chen, Yuanhang – PersonEntity: Name: NameFull: Sui, Yuying – PersonEntity: Name: NameFull: Li, Peng – PersonEntity: Name: NameFull: Zhang, Feng – PersonEntity: Name: NameFull: Yu, Shuhui – PersonEntity: Name: NameFull: Luo, Suibin IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 04 Text: Apr2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 14381656 Numbering: – Type: volume Value: 27 – Type: issue Value: 7 Titles: – TitleFull: Advanced Engineering Materials Type: main |
| ResultId | 1 |