Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.
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| Title: | Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys. |
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| Authors: | Sungkhaphaitoon, Phairote1, phairote.s@psu.ac.th, Chantaramanee, Suchart2 |
| Source: | Journal of Electronic Materials; May2025, Vol. 54 Issue 5, p4154-4165, 12p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-025-11861-3 |
