View in EDS HTML Full Text PDF Full Text

Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.

Saved in:
Bibliographic Details
Title: Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.
Authors: Sungkhaphaitoon, Phairote1, phairote.s@psu.ac.th, Chantaramanee, Suchart2
Source: Journal of Electronic Materials; May2025, Vol. 54 Issue 5, p4154-4165, 12p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 184386006
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Sungkhaphaitoon%2C+Phairote%22">Sungkhaphaitoon, Phairote</searchLink><relatesTo>1</relatesTo>, <i>phairote.s@psu.ac.th</i><br /><searchLink fieldCode="AU" term="%22Chantaramanee%2C+Suchart%22">Chantaramanee, Suchart</searchLink><relatesTo>2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; May2025, Vol. 54 Issue 5, p4154-4165, 12p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=184386006
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-025-11861-3
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 12
        StartPage: 4154
    Titles:
      – TitleFull: Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Sungkhaphaitoon, Phairote
      – PersonEntity:
          Name:
            NameFull: Chantaramanee, Suchart
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 05
              Text: May2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 03615235
          Numbering:
            – Type: volume
              Value: 54
            – Type: issue
              Value: 5
          Titles:
            – TitleFull: Journal of Electronic Materials
              Type: main
ResultId 1