Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process. - Lai, Zelei; Zou, Zhenyou; Ye, Jinyu; Lin, Yibin; Zhou, Xiongtu; Sun, Jie; Guo, Tailiang; Wu, Chaoxing; Yan, Qun; Sun, Lei; Zhang, Yongai (Journal of Materials Science: Materials in Electronics, 2025)